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Primary manufacturer of AI server chips using 3nm technology by end of 2026?
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Apple and Broadcom Develop AI Server Chip 'Baltra' for 2026
Dec 11, 2024, 02:21 PM
Apple Inc. is reportedly collaborating with Broadcom Inc. to develop its first server chip designed specifically for artificial intelligence (AI) applications. This chip, codenamed 'Baltra,' is set for mass production in 2026 and will be manufactured by Taiwan Semiconductor Manufacturing Company (TSMC) using its advanced 3nm process technology. The partnership aims to enhance Apple's capabilities in handling the intensive computing demands of AI features, potentially revolutionizing its cloud computing infrastructure for services like Siri and Apple Maps. Broadcom's stock surged by 4.5% in premarket trading following the announcement, reflecting investor confidence in this strategic move.
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