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What will be the main technological advancement in NVIDIA's Rubin platform by its release in 2025?
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Resolution / Starting Odds
3nm process technology • 25%
Advanced packaging technology • 25%
AI performance improvements • 25%
Other • 25%
Product specifications released by NVIDIA or credible tech reviews
Story
NVIDIA and TSMC Accelerate Rubin Platform by Six Months, Plan Early 2025 Arizona Production of Blackwell AI Chips
Dec 5, 2024, 09:22 AM
NVIDIA and TSMC are reportedly accelerating the development of NVIDIA's next-generation Rubin platform, the successor to Blackwell, aiming for availability six months ahead of schedule, potentially in late 2025 instead of the original 2026 projection. According to sources including Reuters, NVIDIA and TSMC are in discussions to produce NVIDIA's Blackwell AI chips at TSMC's new Arizona plant, with preparations underway to begin early next year and production starting in early 2025. This move could significantly impact the U.S. domestic chip industry, as Blackwell chips are currently exclusively manufactured in Taiwan. The Rubin platform is expected to utilize TSMC's 3nm manufacturing process and advanced packaging technology.
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Hardware advancements • 25%
Software improvements • 25%
Partnerships • 25%
Market expansion • 25%
Increased Parameters • 25%
New Audio Inputs • 25%
Enhanced Output Quality • 25%
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Partnership • 25%
New Product Launch • 25%
No Major Move • 25%
Amazon's Trainium2 • 25%
Nvidia's new chip • 25%
Intel's AI chip • 25%
Other • 25%
Taiwan • 25%
United States • 25%
China • 25%
Other • 25%
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Yes • 50%
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