TSMC to Expand 2nm, 3nm Capacities and Receive $350M EUV Machines by Year-End

Nov 3, 2024, 05:47 PM

TSMC is set to significantly expand its 2nm and 3nm node capacities over the next few years. The 2nm capacity is projected to increase from 30K-35K wafers per month by the end of 2025 to 100K per month by 2027. Meanwhile, the 3nm node is expected to ramp up its contribution through 2025 and remain strong through 2026, with Apple, Nvidia, and AMD among the first customers. Additionally, TSMC's CoWoS capacity is anticipated to rise from 35-40K wafers per month in 2024 to 80K per month by the end of 2025, and further to 140-150K per month in 2026. TSMC is also rumored to receive high numerical aperture extreme ultraviolet (high NA EUV) lithography machines from ASML by the end of this year, which are the world's most advanced chipmaking machines, costing about $350M each. According to Morgan Stanley, TSMC is considering raising prices for its 3nm process and CoWoS advanced packaging technology in 2025 to address surging market demand.