TSMC Begins Construction of €10B Dresden Chip Plant with €5B Subsidies, Production in 2027

Aug 20, 2024, 08:46 AM

Taiwan Semiconductor Manufacturing Company (TSMC) has begun construction on its first European semiconductor fabrication plant in Dresden, Germany. The groundbreaking ceremony was led by TSMC Chairman C.C. Wei and other top executives. This €10 billion investment, which includes €5 billion in subsidies from the German government, is part of a joint venture with Bosch, Infineon, and NXP. The European Commission has approved the subsidy package to support the project, aiming to bolster Europe's chip supply security. Production at the plant is expected to commence in 2027.