Micron Breaks Ground on $9.5 Billion HBM Chip Facility in Singapore, Creating 3,000 Jobs

Jan 8, 2025, 09:00 AM

Micron Technology has commenced construction on a $7 billion advanced semiconductor packaging factory in Singapore, marking the first high bandwidth memory (HBM) chip production facility of its kind in the country. The project is expected to create up to 3,000 jobs and is part of Micron's strategy to enhance its presence in the AI sector. The new plant will be located adjacent to Micron's existing operations in Singapore, further solidifying the city-state's role in the global semiconductor industry.