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VisitAmkor to Receive $600 Million for Peoria Chip Facility Testing Apple and TSMC Chips
Jul 26, 2024, 09:15 AM
Amkor Technology has signed a preliminary memorandum of terms with the US Department of Commerce for an advanced packaging and test facility in Arizona. The company is set to receive up to $400 million in US government grants and approximately $200 million in loans for the project. The first phase of the Peoria facility, which will test chips for Apple and TSMC, is expected to begin production within two to three years.
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