AMD to Challenge Samsung in Smartphone Market with TSMC's 3nm Chip by 2026

Nov 26, 2024, 02:56 AM

Advanced Micro Devices Inc. (AMD) is planning to enter the smartphone chip market with a new Application Processor Unit (APU) in 2026, leveraging Taiwan Semiconductor Manufacturing Co. Ltd.'s (TSMC) advanced 3nm process technology. This move is expected to boost TSMC's 3nm production capacity and secure orders through 2026, positioning AMD to compete with Samsung in the mobile devices market. TSMC, in parallel, is advancing its manufacturing capabilities with the start of production line installation at its 2nm fab in Kaohsiung, south Taiwan, which is six months ahead of schedule. The ceremony for this event was held on November 26, 2024, marking the end of construction and the beginning of operations. The fab is set to open on December 1, 2024, with some machinery already in place. TSMC's 3nm node is reportedly fully booked, with major clients like Apple Inc., Nvidia Corp., and Intel Corp. among others, indicating strong demand for advanced semiconductor technology.